Much like its bigger sibling, the iPhone 6 also features a revamped inner layout and a bigger battery than previous generation devices, according to iFixit.
Further, the iPhone 6 as rumoured ahead of launch packs an 1810mAh battery, and despite being much larger than the iPhone 5s (1560mAh) and iPhone 5c (1510mAh), is smaller when compared to some Android counterparts such as Sony Xperia Z3 (3100mAh), Nexus 5 (2300mAh), HTC One (M8) (2600mAh), and Moto X (2300mAh).
Also in-line with previous leaks and similar to the iPhone 6 Plus, the iPhone 6 features 1GB of RAM. However, iFixit reveals that it is supplied by SK Hynix, unlike the Elpida seen on iPhone 6 Plus. The teardown details the chipset, "Apple A8 APL1011 SoC + SK Hynix RAM 1 GB LPDDR3 RAM."
It's worth noting that both the iPhone 6 and iPhone 6 Plus feature NXP-made NFC chips.
Other companies supplying parts for the iPhone 6 are similar to that of the iPhone 6 Plus such as Murata, which supplies the Wi-Fi module; Broadcom that supplies touchscreen controller; InvenSense supplying gyroscope and accelerometer combo, and Qualcomm chips for power management IC, LTE modem and RF transceiver. The teardown of the iPhone 6 also reveals chips from Skyworks and Avago.
The iPhone 6, unlike the iPhone 6 Plus that featured SK Hynix supplied 128GB NAND flash memory, uses SanDisk supplied 128GB NAND Flash storage.
iFixit points us to Chipwork's blog, which in early analysis concludes the Apple A8 SoC is fabricated by TSMC in a 20nm CMOS process.
Apple's new iPhone 6 and iPhone 6 Plus went on sale starting Friday in selective countries including Japan and Australia.
Notably, Apple received 4 million advance orders for the new iPhones in the first 24 hours, setting a new pre-order record for the company.
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