Xiaomi 18 Fold and Pad 9 Pro Max Confirmed to Launch Next Month With the Firm’s New Xring O3 Chipset

Xiaomi revealed key details about its new proprietary chipset, namely the Xring 03. Now, the tech giant has announced that its upcoming SoC will power two new devices, including its next-generation book-style foldable and flagship tablet. The company has confirmed that the Xiaomi 18 Fold will be launched in China soon, as its first book-style foldable to feature the Xring 03 chipset. Moreover, the Xiaomi Pad 9 Pro Max will also be unveiled in the country with the same Xring SoC. The company has already confirmed that the Xring 03 chip will be accompanied by the Xring O100 AI acceleration chip and the Xring D100 AI chip.

Xiaomi 18 Fold, Pad 9 Pro Max to Launch in September With Xring 03 Chipsets

In a post on Weibo, the Chinese microblogging platform, the smartphone maker has announced that the Xiaomi 18 Fold, its next-generation book-style foldable, will be launched in China in September. The smartphone is confirmed to debut as the first device to feature Xiaomi's proprietary Xring 03 chipset. The foldable will be accompanied by the new flagship tablet, Xiaomi Pad 9 Pro Max, which will be launched with the same Xring 03 chipset as the Xiaomi 18 Fold. However, the exact launch date remains under wraps.

The company has started teasing key details about the Xiaomi Xring 03 chipset. The tech firm has revealed that its future devices will get a tri-chip solution, with the Xring 03 SoC accompanied by the Xring O100 AI acceleration chip and the Xring D100 AI chip. The company claims that the Xring 03 chip managed to score more than 52,20,000 points on the AnTuTu benchmarking platform.

Moreover, Xiaomi says that the Xring 03 SoC is built using a 3nm process, with a 133 sq mm chip area and 24 billion transistors. It will feature a 10-core CPU with six efficiency cores and four performance cores, delivering a peak clock speed of 4.35GHz. It is claimed to have managed to score 3,945 points in single-core performance and 15,221 points in multi-core performance.

The Xring 03 chipset will also feature a 16-core G2 Ultra NX GPU, which is claimed to deliver 85 percent peak performance enhancement and 182 percent ray-tracing performance improvement, while consuming 64 percent less power. It will also support LPDDR6 RAM. The AI chip is claimed to get a new NPU with 200 TOPS AI performance and 3.13 Tera FLOPS.