Huawei Pura 70 Pro+ vs Huawei Ascend Y200 comparison

Compare Huawei Pura 70 Pro+
Compare Huawei Ascend Y200
key specs
Display6.80-inch3.50-inch
Front Camera13-megapixelNo
Rear Camera50-megapixel + 12.5-megapixel + 48-megapixel3.2-megapixel
RAM16GB256MB
Storage512GB-
Battery Capacity5050mAh1250mAh
OSHarmonyOS 4.2Android 2.3
Resolution1260x2844 pixels320x480 pixels
Processor-Qualcomm Snapdragon S1
general
BrandHuaweiHuawei
ModelPura 70 Pro+Ascend Y200
Release dateApril 18, 2024July 1, 2012
Launched in IndiaNo-
Form factorTouchscreenBar
Dimensions (mm)162.60 x 75.10 x 8.40116.90 x 61.40 x 11.70
Weight (g)220.00125.00
IP ratingIP68-
Battery capacity (mAh)50501250
Fast chargingProprietary-
ColoursLightweave Silver, Phantom Black and String White-
Alternate names-U8655
Removable battery-No
display
Resolution StandardFHD+-
Screen size (inches)6.803.50
TouchscreenYesYes
Resolution1260x2844 pixels320x480 pixels
Protection typeOther-
Pixels per inch (PPI)460165
hardware
RAM16GB256MB
Internal storage512GB-
Expandable storageNoYes
Processor-800 MHz one-core
Processor make-Qualcomm Snapdragon S1 (MSM7225A)
Expandable storage type-microSD
Expandable storage up to (GB)-32
camera
Rear camera50-megapixel + 12.5-megapixel + 48-megapixel3.2-megapixel
No. of Rear Cameras3-
Front camera13-megapixelNo
No. of Front Cameras1-
Pop-Up CameraNo-
Rear flash-No
software
Operating systemHarmonyOS 4.2Android 2.3
connectivity
Wi-FiYesYes
Wi-Fi standards supported802.11 a/b/g/n/ac/ax-
GPSYesYes
BluetoothYes, v 5.20Yes, v 2.10
NFCYesNo
USB Type-CYes-
Number of SIMs21
Infrared-No
USB OTG-No
FM-Yes
Wi-Fi Direct-No
Mobile High-Definition Link (MHL)-No
sim 1
SIM TypeNano-SIMRegular
GSM/CDMA-GSM
3G-Yes
4G/ LTE-No
sim 2
SIM TypeNano-SIM-
sensors
Fingerprint sensorYes-
In-Display Fingerprint SensorYes-
Compass/ MagnetometerYesYes
Proximity sensorYesYes
AccelerometerYesYes
Ambient light sensorYesNo
GyroscopeYesNo
Barometer-No
Temperature sensor-No

Advertisement

© Copyright Red Pixels Ventures Limited 2024. All rights reserved.
Trending Products »
Latest Tech News »