Xiaomi 14 is said to be powered by Qualcomm's upcoming Snapdragon 8 Gen 3 SoC, paired with LPDDR5x RAM and UFS 4.0 storage.
Photo Credit: Weibo/ Xiaomi
Xiaomi 14 is seen housing a triple rear camera setup at the top-right of the back panel
Xiaomi 14 series is all set to launch on October 26, as the company previously confirmed in a Weibo post. However, Xiaomi has not announced about the smartphones in the lineup, which are expected to be a basic Xiaomi 14 and a Xiaomi 14 Pro. These could succeed Xiaomi 13 and Xiaomi 13 Pro, respectively. There has been several rumours regarding the specifications and camera of the upcoming smartphones. Now, the Chinese company has teased the design of Xiaomi 14, while another post from a company executive has suggested the upcoming handset to have narrower bezels than the iPhone 15 Pro.
In a Weibo post, Xiaomi has teased the design of the upcoming Xiaomi 14 ahead of its launch on October 26, and also shared some pictures of the smartphone. It has been confirmed to get a 6.36-inch ultra-narrow edge straight display screen. It is seen to debut in at least white colorway. Meanwhile, the smartphone will also get Paris nail texture design. The company has also posted some camera shots from the upcoming smartphone.
In another post, Xiaomi Phones Product Manager Cici Lao Wei has shared that Xiaomi 14 will receive "an extremely narrow four-width design". The chin will be 1.71mm thin, while the bezels on other three sides will measure 1.61mm each, making them even narrower than the iPhone 15 Pro.
According to a previous report, Xiaomi 14 is said to be powered by Qualcomm's upcoming Snapdragon 8 Gen 3 SoC, paired with LPDDR5x RAM and UFS 4.0 storage. It is expected to pack a 4,600mAh battery with support for 90W wired charging, 50W wireless charging and 10W reverse wireless charging.
As shown in the pictures shared by the company, the smartphone houses a triple rear camera setup placed in a square box at the top-right of the back panel. This setup is said to carry a a 50-megapixel main camera with OIS, a 50-megapixel ultra wide-angle sensor and a 50-megapixel telephoto sensor.
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