The Qualcomm Snapdragon 810 chipset that debuted in LG G Flex2 earlier this month is not giving any 'overheating issue' as has been rumoured several times in the past, and earlier this week said to be the reason Samsung is ditching the processor for the Galaxy S6, according to LG Vice President for Mobile Product Planning, Woo Ram-Chan.
Woo dismissed the rumours by stating that "I am very much aware of the various concerns in the market about the [Snapdragon] 810, but the chip's performance is quite satisfactory," and "I don't understand why there is an issue over heat." Woo mentioned this at a LG Flex2 press event in Seoul to reporters (via Reuters).
It is worth noting that the denial of the overheating issue for the Qualcomm Snapdragon 810 just two days after it was reported by Bloomberg that Samsung has decided not use Qualcomm's Snapdragon 810 SoC inside the Galaxy S6 flagship because of overheating issues seen in testing.
A report from last week added that Samsung would initially only release the Galaxy S6 with its own Exynos processor, before releasing the Qualcomm-variant in limited quantities.
The rumours started in early December when it was reported that Qualcomm Snapdragon 810 heats up at certain voltage levels, resulting in under-performance. The company's Adreno 430 GPU was being said to be giving problems due to errors found in the drivers. The RAM controller of the application was also facing issues. Other reports indicated the problem had existed, but had been fixed.
However, the launch of LG G Flex2 and the comments by Woo Ram-Chan might end the long list of rumours. Qualcomm's leaked roadmap for 2015 also hints at Snapdragon 820 and range of mid-tier Snapdragon 6xx chipsets.
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